Hot-Dip Coating Process
H. Tasaki et al, assignors fo NipponMining8 Metals Co. Ltd., Tokyo
U.S. Patent5,364,277.Nov.15, 1994 WT.Crumly et al., assignors to Hughes Aircraft Co.,
An electrical circuit comprising a dielectric substrate, and a pattern of conductive traces on one side of the substrate with at least one of the conductive traces having a three-dimensional conductive circuit feature formed integrally therewith and projecting from the trace surface in a first direction for providing a readily connectable and disconnectable pressure interconnection to another element.
Electroless Gold Bath
U.S. Patent5,364,478.Nov.15, 1994
A method for producing a brown coated article, wherein an iron substrate is dipped at a temperature of from 430-6OOT in a molten zinc plating bath containing from 0.05-l% by weight of manganese, so as to zinc hot-dip galvanize the same, a heat treatment is carried out to convert a zinc-manganese phase formed by the zinchot dip galvanizing to a zinc-manganeseiron phase, and, subsequently the zinc hot-dip galvanizing layer is brought into contact with an acidic aqueous solution containing an oxidizing agent.
solution that is in the bath; allowing acid solution to overflow at a level from the top of the bath, recirculating at least a portion of the acid etch solution, which overflows from the bath, back into the bath; and maintaining the temperature of the acid etch solution.
U.S. fatent5,364,518. Nov. 15, 1994
K. [email protected]
ef al, assignors to LeyMd AG, Hanau, Germany
An apparatus for coating a substrate, comprising a tubular cathode on which a tubular target is fixed, said cathode being rotatable about a central axis.
U.S. Patent5,364,460. Nov. f5, 1994
K. Morimofo et al, assignors to C. Uyemura & Co. Ltd., Osaka, Japan
An electroless gold plating bath comprising a gold sulfite; a sulfite as a complexing agent for gold ion; at least one reducing agent selected from the group consisting of a hydrazine, ascorbic acid, a salt of ascorbic acid, trimethylamineborane, and dimethylamineborane; and an organic phosphonic acid or a salt thereof.
Method of Electroplating Half Sliding Bearings
Acid Etch Apparatus and Process
U.S. fatenf5,364,523.Nov.15, 1994
U.S. Pafenf $384,494.Nov.15, 1994
7: Tanaka et al, assignors to Daido Metal Co. Ltd., Nagoya, Japan
G.E. Hutchisonand R.L. Riddle, assignors to UniversalEngravingInc., Over/and Park, Kan.
A process for electrodepositing a metallic layer on half sliding bearings in an electroplating tank, wherein the electrodeposition of the metallic layer is carried out while the bearings are moved vertically in
A method of acid etching a metal die
comprising the steps of positioning a metal die above a bath of acid etch solution; exposing the metal die to the acid etching
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US Patent #4,917,650 Circle 140 on reader information card
. JUNE 1995