Granted in the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.
HYDRODYNAMICALLY CONTROLLER NULL CELL
ELECTROCHEMICAL DEBURRING OR RADIUSING
U.S. Patent 6,139,711. Oct. 31, 2000 J.A. Abys et al., assignors to Lucent Technologies Inc., Murray Hill, N.J.
U.S. Patent 6,139,715. Oct. 31, 2000 B. Wei, assignor to General Electric Co., Schenectady, N.Y. A method for electrochemical deburring or radiusing of a TZM workpiece with a tool electrode, poled to cause the tool electrode to act as a cathode and TZM workpiece to act as an anode, comprising the directing of a binary salt electrolyte solution comprising aqueous sodium chloride and sodium nitrate through a gap between the tool electrode and TZM workpiece; and applying a pulsating current across the gap.
An i n s t r u m e n t for m e a s u r i n g throwing power of an electrolyte c o m p r i s i n g a cylindrical b o d y adapted for rotation about a longitudinal axis thereof; a cylindrical cathode a r r a n g e d coaxially about the central portion of the cylindrical body; an anode coaxially positioned at the lower end portion of the cylindrical body; a conical shield coaxially arranged around the upper end portion of the cathode; and an annular diskbaffle coaxially arranged around the lower end portion of the cathode, wherein the conical shield and disk-baffle provide a substantially linear current distribution over the cathode.
POROUS A N O D I Z E D A L U M I N A FILM
U.S. Patent 6,139,713. Oct. 31, 2000 H. Masuda et al., assignors to Nippon Telegraph and Telephone Corp., Tokyo
A method of forming a porous anodized alumina film characterized by forming a plurality of recesses in a surface of a smooth a l u m i n u m plate in a predetermined a r r a y at a p r e d e t e r m i n e d interval; and anodizing the alum i n u m plate to form a porous anodized a l u m i n a film h a v i n g pores having a p r e d e t e r m i n e d shape and the same interval and a r r a y as those of the plurality of recesses. September 2001
P A L L A D I U M SURFACE C O A T I N G SUITABLE FOR W I R E B O N D I N G
U.S. Patent 6,139,977. Oct. 31, 2000 J.A. Abys et al., assignors to Lucent Technologies Inc., Murray Hill, N.J.
An article of manufacture comprising a s u b s t r a t e h a v i n g at least one material layer formed thereon, which has a hardness less than about 250 KHN~o; and a palladium layer formed on the at least one material layer, wherein the palladium layer has a hardness less than about 500 KHNso.
ble entrapment within the cured coating film formed from the powder coating composition; and a curing agent. SELF-CATALYTIC BATH FOR DEPOSITION OF NICKEL-PHOSPHORUS ALLOY
U.S. Patent 6,143,059. Nov. 7, 2000 A. Tangi et al., assignors to SGSThompson Microelectronics S.A., Gentilly, France A self-catalytic bath comprising nickel sulfate; sodium hypophosphite as a reducing agent; acetic acid as a buffer; traces of lead as a stabilizer; and a citrate used as a complexing agent and associated with a gluconate that is used both as a catalyst and a stabilizer. WAFER PLATING PROaEfAi
U.S. Patent 6,143,155. Nov. 7, 2000 J.A. Adams et al., assignors to SpeedFam IPEC Corp., Chandler, Ariz. A method for simultaneous noncontact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly. PLATING PERMEABLE CORES
EPOXY POWDER C O A T I N G
U.S. Patent 6,140,430. Oct. 31, 2000 W.G. Ruth et al., assignors to Morton International Inc., Chicago A t h e r m o s e t t i n g epoxy powder coating composition in particulate form comprising a film-forming blend of at least one noncrystalline epoxy resin; from 5 to 15% by weight of at least one crystalline epoxy resin in an amount sufficient to reduce or eliminate bub-
U.S. Patent 6,143,157. Nov. 7, 2000 L.L. Andrus et al., assignors to VLT Corp., San Antonio, Texas
A method comprising covering a magnetically permeable core with a barrier coating to protect a magnetic property of the core from alteration by a subsequent plating process, and then plating a conductive shield to the core by depositing a seed layer in a predet e r m i n e d p a t t e r n defined by a 97