Replacement liner for a powder coating apparatus

Replacement liner for a powder coating apparatus

at least one of the spray nozzles being arranged nonlinearly on a common manifold relative to another two of the nozzles. POWDER COATING COMPOSITION ...

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at least one of the spray nozzles being arranged nonlinearly on a common manifold relative to another two of the nozzles. POWDER

COATING COMPOSITION

15%.Patent

J M. Bagala

6,325,846.

Dec. 4,200l

and K.N. Beale, assig

nors to Engelhard

Corp, Iselin, NJ

A powder coating composition comprising a mixture of particulate resin carrier and particulate pigment in which the pigment is a laminar metal-containing pigment having a first coating thereon of hydrated aluminum oxide or a combination of hydrated cerium and aluminum oxides, and a coating of hydrolysed silane coupling agents on or intermingled with the first coating.

US. Patent Nordson

Corp., Westlake,

to

Ohio

SPRAY NOZZLE

structure comprising defining a via in the insulating layer over an active area in the substrate; forming a titanium-containing layer in the via and over the insulating layer; forming a patterned catalyst layer over the titanium-containing layer; and depositing copper onto exposed regions of the titanium-containing layer using electroless deposition. REPLACEMENT POWDER

US. Patent

LINER FOR A

COATING APPARATUS

6,328,224.

K.L. Alexander,

Dec. II,2001

assignor

to Illinois

Tools Works Inc., Glenview, ELECTROLESS COPPER DEPOSITION ON TITANIUM

US. Patent

6,326,303.

K. Robinson

Dec. 4,200l

and T Taylor, assignors Technology

Inc., Boise, Id.

A method for forming a plug in an integrated circuit interconnect

WITH AN IMPROVED

l

Dec. 4,200l

A system for spray coating a substrate with a liquid coating material comprising a liquid spray device having a liquid delivery passageway for supplying liquid coating material and an air delivery passageway for supply pressurized air; a nozzle mounted to the liquid spray device; a controller operatively connected to the liquid spray device whereby coating material is applied as a swirling atomized spray pattern.

to Micron APPARATUS

6,325,853.

F! T Hogan et al., assignors

Ill.

A dispersing device for a coating material, the dispensing device including an outer portion including a first, inner surface, the outer portion having a central passageway for mounting the outer portion in a rotary

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WATER

800-462-3120

CHILLERS l

www.ritetemp.com

Circle 082 on reader card or go to www.thru.to/webconnect Metal Finishing

shaft for rotating the dispensing device, and an inner portion having a second, outer surface shaped complementarily to the first surface and a somewhat bell- or cup-shaped third, inner surface, and means for retaining the inner portion in the outer portion with the first and second surfaces in engagement. COMPOSITION

FOR DEGREASING

METALS US. Patent 6,328,816.

Dec. 11,200l

L.R. Carlson and JR. Pierce, assignors to Henkel Corp., Gulph Mills, Pa.

A process for removing oily, greasy, or waxy soil from an aluminum surface comprising contacting at a pH within the range of 4.5 to 6 with an aqueous liquid composition that is free of silicates and contains an amine oxide surfactant.

CONDUCTIVE

POLVMIR-ALUMINUM

OXIDE COMPOSITE

COATING

FOR

conductive polymer intermixed with aluminum oxide.

ALUMINUM

U.S. Patent 6,328,874. Dec. II,2001

ELWTROPLATING

I? J Kinlen et al., assignors to

MOLDINGS

PLASTIC

McDonnell Douglas Corp., St. Louis

US. Patent 6,331,239. Dec. 18,200l

A method for protecting an aluminum surface from corrosion comprising contacting with a mixture of water, a multifunction polymeric organic acid, and a monomer of an intrinsically conductive polymer and imposing an electrical potential between the aluminum surface as the anode and a cathode, where the electrical potential is sufficient to polymerize the monomer of the intrinsically conductive polymer and to form aluminum oxide, thereby forming on the aluminum surface a coating of the multifunctional polymeric organic acid salt of the intrinsically

H. Shirota, and J Okada, assignors to Okuno Chemical Industries

Co.

Ltd., Osaka, Japan

A method of electroplating nonconductive plastic moldings comprising applying a catalyst useful for electroless plating to nonconductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound; forming an electrically conductive coating on the surface of the moldings using an electroless copper plating solution consisting essentially of a copper compound, a reducing agent consisting of at least one saccharide having a reducing property, a

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Circle 068

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